物料参数

Product Lifecycle:	量产
Package:	8-Ball WLCSP (1.43mm x 1.775mm),8-Lead SOIC,8-Lead MSOP
# of Amps:	2
GBP (typ):	10MHz
Slew Rate (typ):	5V/us
Vos (typ):	80µV
Vos (max):	65µV
Vos TC (typ):	1µV/°C
VNoise Density (typ):	6.5nV/rtHz
Current Noise Density (typ):	10fA/rtHz
0.1 to 10 Hz VNoise (typ):	2.3µV p-p
Ibias (typ):	200fA
Ibias (max):	1pA
Ios (typ):	100fA
Ios (max):	500fA
Rail to Rail:	Both
Iq/Amp (typ):	1.2mA
Iq/Amp (max):	1.2mA
Vs span (min):	2.7V
Vs span (max):	5V
CMRR (typ):	85dB
CMRR (min):	85dB
Input Architecture:	CMOS
PSRR DC (min):	80dB
PSRR DC (typ):	95dB
Out V+ Headroom (max):	300mV
Out V+ Headroom (typ):	20mV
Out V- Headroom (typ):	20mV
Out V- Headroom (max):	210mV
Aol (typ):	109dB
Min Stable Gain:	1V/V
Shutdown:	No
Iout (typ):	80mA
Over-the-Top:	No
Ccm (typ):	8.8pF
Cdiff (typ):	2.6pF
Open Loop Rout:	15Ohms
Feedback Type:	Voltage
Package Area:	2.701mm² (8-Ball WLCSP (1.43mm x 1.775mm)) (AD8606ACBZ-REEL7)mm²
Eval / Ref Circuit:	Evaluation board, Reference circuit
Export Classification:	EAR99
Automotive:	No
Temp Range:	-40 to 125°C
Package Finish Code:	E1, E3
Package Height:	0.38mm (8-Ball WLCSP (1.43mm x 1.775mm)) (AD8606ACBZ-REEL7)mm
Launch Date:	2007-10-15
Terminal Finish:	E1, E3
Temp Range Code:	NA
EP:	No