INTEGRATED SILICON

None

商品列表
IS62WV102416ALL-35MLI
供应商: Arrow Electronics
分类: SRAM Chip
描述: SRAM Chip Async Single 1.8V 16M-Bit 1M x 16 35ns 48-Pin TFBGA
SupplierTemperatureGrade: Industrial TimingType: Asynchronous HTS: 8542.32.00.41 MaximumOperatingSupplyVoltage(V): 2.2 ECCN(US): 3A991b.2.a. PartStatus: Active PPAP: No MinimumOperatingSupplyVoltage(V): 1.65 MaximumOperatingTemperature(°C): 85 Automotive: No LeadShape: Ball PCBchanged: 48 ChipDensity(bit): 16M DataRateArchitecture: SDR PackageLength: 11 MaxAccessTime(ns): 35 StandardPackageName: BGA AddressBusWidth(bit): 20 NumberofBits/Word(bit): 16 NumberofPorts: 1 TypicalOperatingSupplyVoltage(V): 1.8 OperatingCurrent(mA): 30 Mounting: Surface Mount SupplierPackage: TFBGA PackageHeight: 0.9(Max) PackageWidth: 9 NumberofWords: 1M MinimumOperatingTemperature(°C): -40 PinCount: 48
IS61VPS204836B-250B3L
供应商: Arrow Electronics
分类: SRAM Chip
描述: SRAM Chip Sync Quad 2.5V 72M-bit 2M x 36 2.6ns 165-Pin BGA
EU RoHS: Compliant Density (bit): 72M Address Bus Width (bit): 21 Maximum Access Time (ns): 2.6 Timing Type: Synchronous Maximum Clock Rate (MHz): 250 Data Rate Architecture: SDR Maximum Operating Current (mA): 360 Typical Operating Supply Voltage (V): 2.5 Number of Bits per Word (bit): 36 Number of Ports: 4 Number of Words: 2M Minimum Operating Supply Voltage (V): 2.375 Maximum Operating Supply Voltage (V): 2.625 Minimum Operating Temperature (°C): 0 Maximum Operating Temperature (°C): 70 Mounting: Surface Mount Package Height (mm): 0.79 Package Length (mm): 15 Package Width (mm): 13 PCB changed: 165 Standard Package Name: BGA Supplier Package: BGA Pin Count: 165 Lead Shape: Ball
IS31AP2010B-UTLS2-TR
供应商: Arrow Electronics
分类: Audio Amplifier
描述: Audio Amp Speaker 1-CH Mono 3W Class-D 9-Pin UTQFN T/R
EU RoHS: Compliant Function: Speaker Amplifier Type: Class-D Rail to Rail: No Input Signal Type: Differential Typical Output Power x Channels @ Load (W): 3x1@4Ohm Output Signal Type: Differential Output Type: 1-Channel Mono Maximum Load Resistance (Ohm): 8 Minimum Operating Temperature (°C): -40 Maximum Operating Temperature (°C): 85 Packaging: Tape and Reel Typical PSRR (dB): 75 Minimum Single Supply Voltage (V): 2.7 Typical Single Supply Voltage (V): 3|5 Maximum Single Supply Voltage (V): 5.5 Total Harmonic Distortion Noise: 0.22%@4Ohm@1.1W|0.18%@8Ohm@0.6W Power Supply Type: Single Mounting: Surface Mount Package Height (mm): 0.55(Max) Package Length (mm): 1.55(Max) Package Width (mm): 1.55(Max) PCB changed: 9 Standard Package Name: QFN Supplier Package: UTQFN Pin Count: 9 Lead Shape: No Lead
IS61LV2568L-10TL-TR
供应商: Arrow Electronics
分类: SRAM Chip
描述: SRAM Chip Async Single 3.3V 2M-bit 256K x 8 10ns 44-Pin TSOP-II T/R
EU RoHS: Compliant Density (bit): 2M Address Bus Width (bit): 18 Maximum Access Time (ns): 10 Timing Type: Asynchronous Maximum Operating Current (mA): 60 Typical Operating Supply Voltage (V): 3.3 Number of Bits per Word (bit): 8 Number of Ports: 1 Number of Words: 256K Minimum Operating Supply Voltage (V): 2.97 Maximum Operating Supply Voltage (V): 3.63 Minimum Operating Temperature (°C): 0 Maximum Operating Temperature (°C): 70 Packaging: Tape and Reel Mounting: Surface Mount Package Height (mm): 1.05(Max) Package Length (mm): 18.52(Max) Package Width (mm): 10.29(Max) PCB changed: 44 Standard Package Name: SOP Supplier Package: TSOP-II Pin Count: 44 Lead Shape: Gull-wing
IS42S16100H-7TLI-TR
供应商: Arrow Electronics
描述: 16M, 3.3V, SDRAM, 1MX16, 143MH
SupplierTemperatureGrade: Industrial Organization: 1Mx16 HTS: 8542.32.00.41 MaximumAccessTime(ns): 6|5.5 MaximumOperatingSupplyVoltage(V): 3.6 ECCN(US): EAR99 PartStatus: Active PPAP: No DRAMType: SDRAM MinimumOperatingSupplyVoltage(V): 3 MaximumOperatingTemperature(°C): 85 Automotive: No LeadShape: Gull-wing PCBchanged: 50 InterfaceType: LVTTL ChipDensity(bit): 16M NumberofInternalBanks: 2 PackageLength: 20.95 NumberofWordsperBank: 512K DataBusWidth(bit): 16 StandardPackageName: SO AddressBusWidth(bit): 12 NumberofBits/Word(bit): 16 TypicalOperatingSupplyVoltage(V): 3.3 OperatingCurrent(mA): 70 Mounting: Surface Mount SupplierPackage: TSOP-II PackageHeight: 1.05(Max) MaximumClockRate(MHz): 143 PackageWidth: 10.16 Packaging: Tape and Reel MinimumOperatingTemperature(°C): -40 NumberofI/OLines(bit): 16 PinCount: 50
IS42S16100H-7BL
供应商: Arrow Electronics
分类: DRAM Chip
描述: DRAM Chip SDRAM 16Mbit 1Mx16 3.3V 60-Pin TFBGA
EU RoHS: Compliant Chip Density (bit): 16M Max. Operating Temperature (°C): 70 DRAM Type: SDRAM Maximum Clock Rate (MHz): 143 Typical Operating Supply Voltage (V): 3.3 Organization: 1Mx16 Number of Internal Banks: 2 Number of Words per Bank: 512K Data Bus Width (bit): 16 Maximum Access Time (ns): 6|5.5 Address Bus Width (bit): 12 Minimum Operating Supply Voltage (V): 3 Maximum Operating Supply Voltage (V): 3.6 Operating Current (mA): 60 Min. Operating Temperature (°C): 0 Mounting: Surface Mount Package Height (mm): 0.85(Max) Package Length (mm): 10.1 Package Width (mm): 6.4 PCB changed: 60 Standard Package Name: BGA Supplier Package: TFBGA Pin Count: 60 Lead Shape: Ball
IS42S16800F-6BL-TR
供应商: Arrow Electronics
分类: DRAM Chip
描述: DRAM Chip SDRAM 128Mbit 8Mx16 3.3V 54-Pin TFBGA T/R
EU RoHS: Compliant Density (bit): 128M Type: SDRAM Organization: 8Mx16 Data Bus Width (bit): 16 Maximum Clock Rate (MHz): 166 Number of Internal Banks: 4 Number of Words per Bank: 2M Maximum Access Time (ns): 6.5|5.4 Address Bus Width (bit): 14 Maximum Operating Current (mA): 120 Typical Operating Supply Voltage (V): 3.3 Maximum Operating Supply Voltage (V): 3.6 Minimum Operating Supply Voltage (V): 3 Minimum Operating Temperature (°C): 0 Maximum Operating Temperature (°C): 70 Packaging: Tape and Reel Mounting: Surface Mount Package Height (mm): 0.8(Max) Package Length (mm): 8 Package Width (mm): 8 PCB changed: 54 Standard Package Name: BGA Supplier Package: TFBGA Pin Count: 54 Lead Shape: Ball
IS25LQ032B-JNLE
供应商: Arrow Electronics
分类: Flash
描述: 8/16/32M-BIT3V- QUAD SERIAL FLASH MEMORY WITHMULTI-I/O SPI
EU RoHS: Compliant Mounting: Surface Mount Package Height (mm): 1.5(Max) Package Length (mm): 5(Max) Package Width (mm): 4(Max) PCB changed: 8 Standard Package Name: SOP Supplier Package: SOIC N Pin Count: 8 Lead Shape: Gull-wing
IS43DR16640B-25DBL-TR
供应商: Arrow Electronics
分类: DRAM Chip
描述: DRAM Chip DDR2 SDRAM 1Gbit 64Mx16 1.8V 84-Pin TW-BGA T/R
EU RoHS: Compliant Density (bit): 1G Type: DDR2 SDRAM Organization: 64Mx16 Data Bus Width (bit): 16 Maximum Clock Rate (MHz): 800 Number of Internal Banks: 8 Number of Words per Bank: 8M Address Bus Width (bit): 16 Maximum Operating Current (mA): 240 Typical Operating Supply Voltage (V): 1.8 Maximum Operating Supply Voltage (V): 1.9 Minimum Operating Supply Voltage (V): 1.7 Minimum Operating Temperature (°C): 0 Maximum Operating Temperature (°C): 70 Packaging: Tape and Reel Mounting: Surface Mount Package Height (mm): 0.8(Max) Package Length (mm): 12.5 Package Width (mm): 8 PCB changed: 84 Standard Package Name: BGA Supplier Package: TW-BGA Pin Count: 84 Lead Shape: Ball
IS61WV102416ALL-20TLI
供应商: Arrow Electronics
分类: SRAM Chip
描述: SRAM Chip Async Single 1.8V 16M-Bit 1M x 16 20ns 48-Pin TSOP-I
SupplierTemperatureGrade: Industrial TimingType: Asynchronous HTS: 8542.32.00.41 MaximumOperatingSupplyVoltage(V): 2.2 ECCN(US): 3A991b.2.a. PartStatus: Active PPAP: No EURoHS: Compliant MinimumOperatingSupplyVoltage(V): 1.65 MaximumOperatingTemperature(°C): 85 Automotive: No LeadShape: Gull-wing PCBchanged: 48 ChipDensity(bit): 16M DataRateArchitecture: SDR PackageLength: 12.2(Max) ProcessTechnology: CMOS MaxAccessTime(ns): 20 StandardPackageName: SOP AddressBusWidth(bit): 20 NumberofBits/Word(bit): 16 NumberofPorts: 1 TypicalOperatingSupplyVoltage(V): 1.8 OperatingCurrent(mA): 60 Mounting: Surface Mount SupplierPackage: TSOP-I PackageHeight: 1.05(Max) PackageWidth: 18.6(Max) NumberofWords: 1M MinimumOperatingTemperature(°C): -40 PinCount: 48